Advanced Semiconductor Engineering (ASE) and PCB manufacturer Wus Printed Circuit are teaming up to build a new packaging facility in southern Taiwan, as the world's largest chip assembler moves to expand capacity ahead of surging AI-driven demand. The plant, to be located in the Kaohsiung Nanzih Technology Industrial Park, is scheduled to open in September 2029.
AI Brief
Your highlights
This article is available on the publisher's site.